Using Plasma to etch a silicon

ORDER NOW

1. Extend chapters 1 and 2 to around 50 pages. [I already have 25 pages for these]

2. Divide chapter 3 into two chapters (3 and 4). [I already have 11 pages for these]
(Chapter 3 - using single chamber // Chapter 4 - using two chambers for comparison)
The title for them:
Chapter 3: Investigate the effect of varying the oxygen concentration in SF6/O2 plasma on the silicon substrate anisotropic etch. Mainly investigated the effect plasma density
Chapter 4: Investigate the effect of the plasma chamber geometry on the nature of Si anisotropic etch. Mainly investigated the effect geometry chamber and compassion between two chambers,

Chapter 5 conclusion